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Resumes

Philippe R. Vaney

Expertise:

  • New Product Introduction & Manufacturing Startup
  • Cost & Cycle Time Reduction
  • Business Process Improvement
  • Program Management

    Experience:

    Philippe has 18 years of experience in managing new technology and product introductions ranging from semiconductor components to systems. Most recently, Philippe was Vice President of Operations for Corrent Corporation, a fabless semiconductor startup developing encryption chips for Internet security, where he was responsible for Supplier Management, Product Engineering, Program Management, Manufacturing & Logistics, Information Systems, Business Process Development, and Facilities. Prior to joining Corrent, Philippe spent 16 years at Intel Corporation focusing on introducing and ramping new technologies and products into high volume manufacturing production. He was Operations Manager for Intel's Home Products Group, an internal startup focused on developing a family of internet appliances where he managed the Planning, Manufacturing Engineering, Materials, Test Engineering, and Q&R functions ($6M annual budget). Previous assignments in the Assembly Technology Development organization of Intel's Technology & Manufacturing Group included: HVM Startup Manager for Flip-Chip assembly technology: In this capacity he formed and led a multi-disciplinary, cross-site team that successfully designed and equipped two new HVM factories and then retrofitted two existing facilities for layout & operational copy-exact. Information Systems & Automation Manager: Managed development and deployment of integrated Yield & Manufacturing Data Systems to support new technology Discovery, Development, Cert. and Transfer Activities. Managed centralized NPI Documentation/Release and Assembly manufacturing integration support (silicon tapeout & build kit approvals) for all Intel products. Manufacturing Program Manager: Managed numerous technology improvement activities including cost reduction, yield enhancement, component quality & reliability, silicon/package integration.

    Education:

  • MS Mechanical Engineering, Rensselaer Polytechnic Institute
  • BS Mechanical Engineering, Rensselaer Polytechnic Institute



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    Phone: 520-568-6355     Fax 520-568-6354

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